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华为公司2012实验室中央硬件工程院欧洲博士专场座谈会

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座谈会安排
        对口专业领域学生分地域安排座谈,进行详细岗位介绍,并答疑解惑。具体安排如下:
第一场:瑞士 苏黎世
时间:2016年11月21日 19:00-21:00
第二场:瑞士 洛桑
时间:2016年11月22日 19:00-21:00
第三场:意大利 米兰
时间:2016年11月23日 19:00-21:00
第四场:法国 巴黎
时间:2016年11月24日 19:00-21:00
第五场:比利时 鲁文
时间:2016年11月25日 19:00-21:00
第六场:荷兰 代尔夫特
时间:2016年11月26日 15:00-17:30
报名方式
        请您于该城市座谈会前三天将中英双语简历发送至马卫华女士邮箱shina.ma@huawei.com,邮件标题模板:学校+专业+意向岗位+参加城市,根据岗位匹配情况及您的所在地点给您发送座谈会邀请函。
        对本次活动有任何疑问可向马卫华女士邮件咨询。
需求专业
       计算机及软件、算法、电气工程、机械制造、材料科学、数学、物理、化学等学科专业的优秀博士。
       相关细化专业(包括但不限于):电子通信、微电子、图像处理、电磁场与微波、机械设计、控制、工程热物理、热设计、光学、计算机、电子工程、软件工程、计算数学、存储、材料工艺、器件、传感器、加速器等技术方向。
招聘对象
2015年6月1日-2017年12月31日毕业的博士留学生。
招聘岗
1 信号处理工程师
岗位要求:
1、电子、通信、信号处理等相关专业;
2、了解通信原理,熟悉PHY层基本算法原理和流程,对数字信号处理/信道编译码/调制解调等物理层算法有深入理解。熟悉MAC层基本算法原理和流程,熟悉通信协议。熟练使用算法仿真工具matlab。
2 媒体算法工程师
岗位要求:
1、计算机、自动化、应用数学、声学处理、数字信号处理、模式识别、人工智能、光电等专业;
2、视觉智能、语音智能、深度学习、视频处理、音频处理、图像处理、终端多媒体等领域的技术研究和系统设计、技术开发经验优先。
3 传感器应用研究工程师
岗位要求:
1、计算机、传感器、电子、自动化、数学、光电、超声、生仪、信号与信息处理、模式识别、人工智能等专业;
2、具备运动检测、体征检测、生物识别、智能交互、情景感知等领域的技术研究、算法/器件设计开发、系统设计者优先。
4 存储介质/算法研究工程师
岗位要求:
1、计算机、通信、数学、物理、微电子、自动化等专业。
2、精通信号处理,熟悉BCH、LDPC等ECC算法,具备SSD、Flash、新介质、算法及控制器开发、GPU开发、分布式存储软件,存储集群管理相关经验优先。
5 数据中心网络研究工程师
岗位要求:
1、计算机、通信、数学等网络相关专业;
2、有网络低延时、融合网络协议、异构资源池、NFV/SDN、网络架构建模、网络流量建模、网络算法、网络运维等方面的研究经验。
6 加速算法工程师
岗位要求:
1、计算机体系结构、信息安全、通信工程、电子工程、微电子、数学、物理等相关专业;
2、有异构加速建模、机器学习、数据压缩、数据挖掘、安全与可信计算、分布式计算(Hadoop/Spark)、模式匹配任一研究经验者优先。
7 处理器计算研究工程师
岗位要求:
1、  计算机体系架构、机器学习、数据库、数据挖掘、数学、可信计算、密码学、安全技术、数学等专业;
2、有处理器架构研究、仿真、设计等方面经验优先。
8 硬件安全算法工程师
岗位要求:
1、信息安全、微电子、物理、数学等相关专业;
2、掌握常用硬件安全防护与测评方法,有故障注入、侧信道安全防护算法设计经验、安全威胁分析、密码算法设计任一研究经验。
9 光学设计技术工程师
岗位要求:
1、光学工程、光电信息工程、物理电子学、微电子学与固体电子学、电子信息材料与元器件、半导体芯片系统设计与工艺、材料物理与化学、电力电子与电力传动、集成电路工程、电子与通信工程等相关专业;
2、影像系统光学设计、光学仿真、光学性能测试、镜头制造与组立技术、近/远红外成像系统相关经验。
10 工艺可靠性工程师
岗位要求:
1、电子封装、机械、力学、材料等相关工科专业;
2、具备“钎焊焊接可靠性,电子封装可靠性、可靠性数学统计分析、有限元仿真、力学分析(结构强度、应变测试、应力评估)、失效分析(切片、微观观察)”等经验。
11 高分子材料工艺工程
岗位要求:
1、高分子材料改性、高分子材料合成、有机合成、化学等相关专业;
2、有应用/工程,非理论计算、材料表征分析技术等经验。
12 (半导体)器件可靠性工程师
岗位要求:
1、电子工程、微电子、半导体材料、电子元器件可靠性等相关专 业,具备较好的可靠性物理,数据统计知识基础;
2、熟悉半导体器件的工艺制程、失效分析理论和机理,对可靠性模型、试验设计、数据处理等,有实践经验和案例。
13 传感器器件工程师
岗位要求:
1、电子科学与工程、传感器技术、微电子、机械制造、微纳米、半导体等相关专业;
2、熟悉传感器设计、工艺及封装特点,熟悉传感类器件常见的缺陷模式和机理,熟悉智能终端用传感器的工作原理,和应用,有解决实际问题的经验。
14 音频器件工程师
岗位要求:
1、声学、电子科学与技术等相关专业;
2、了解声学原理知识,熟悉音频器件发展趋势和技术路标。
15 光电互连设计工程师
岗位要求:
1、光电信息工程、光纤通信、电磁场微波等相关专业;
2、熟悉数字光通信理论知识,对主流光模块、光器件有一定了解,熟悉光通信领域相关行业标准及组织。
16 射频微波互连工程师
岗位要求:
1、电磁场与微波相关专业;
2、射频微波电路、射频/微波链路设计与优化、滤波器设计、天线设计与阵列综合等方面的相关经验。
17 工程电磁材料工程师
岗位要求:
1、电磁场、通信专业毕业;
2、了解金属、非金属材料,熟悉结构材料和工艺相关的电磁场、无源互调等方面研究工作。
18 功能材料&非金属(材料)工程师
岗位要求:
1、高分子材料或无机非金属材料专业;
2、熟悉非金属类的功能材料及其工艺的技术开发和研究工作。
19 热设计工程师
岗位要求:
1、工程热物理、热能工程、制冷与低温、暖通、流体机械、声学降噪等相关专业或研究方向;
2、有传热、制冷或降噪等相关的项目研究经验。
20 电磁场与微波工程师
岗位要求:
1、电磁场与微波相关专业;
2、在电磁场与微波技术、天线设计、电磁材料、电磁测量有坚实的基础理论,从事过相关项目研究。
21 流体力学工程师
岗位要求:
1、流体力学、空气动力学、计算流体力学专业。
2、熟悉风扇、机翼或飞行器设计流程,善于提升气动性能。了解气动声学基理,能利用气动声学模拟方法或理论知识解决噪声问题。熟悉非定常流动模拟(DES,DNS)及定常流动模拟(RANS)。精通计算流体力学软件算法(Fluent, CFX, CFD++,Star CD/LT, Flotherm, SCRYU/Tetra)。
22 电机研究工程师
岗位要求:
1、机电一体化、电机与电气、自动化、机械类相关专业;
2、熟悉微机械精密设计、动力学建模仿真、磁路仿真设计、磁性材料、电机控制等先进技术,围绕电机系统展开研究。熟练应用Pro/E、Solidworks、AutoCAD软件对零件进行三维和工程图的设计,精通Jmag、Ansoft软件的仿真应用。
23 微电机研究工程师
岗位要求:
1、微机电、微电子等相关专业。
2、掌握VCM/MEMS等微电机设计原理,熟悉微机械精密设计、电气仿真设计、力学建模仿真设计,能够对微电机性能进行测试和实验研究。熟练掌握机械制图和光刻模板设计(Solidworks/Pro-E/ACAD/ L-EDIT),以及有限元分析 (Anasys/ COMSOL)。
24 电气安全保护研究工程师
岗位要求:
1、电力与电子工程等相关专业;
2、有电力安全保护、应用研究相关经验,掌握电力安全保护(如fuse/断路器)的基础原理,能够进行电力安全保护领域的仿真、分析和设计。
工作地点
深圳、上海、杭州、西安、成都等地。
华为公司简介
        作为全球领先的信息与通信解决方案供应商,华为为电信运营商、企业和消费者等提供有竞争力的端到端ICT解决方案和服务,帮助客户在数字社会获得成功。我们坚持聚焦战略,对电信基础网络、云数据中心和智能终端等领域持续进行研发投入,以客户需求和前沿技术驱动的创新,使公司始终处于行业前沿,引领行业的发展。我们每年将销售收入的10%以上投入研发,在近17万华为人中,超过45%的员工从事创新、研究与开发。华为在170多个标准组织和开源组织中担任核心职位,已累计获得专利授权38,825件。
        华为积极致力于社会经济的可持续发展,运用信息与通信领域专业经验,弥合数字鸿沟,让人人享有高品质的宽带联接;我们努力保障网络的安全稳定运作,助力客户和各行各业提升效率、降低能耗,推动低碳经济增长;我们开展本地化运作,构建全球价值链,帮助本地发挥出全球价值,实现整个产业链的共赢。
        我们深信:未来将是一个全联接的世界。华为与合作伙伴一起,开放合作,努力构建一个更加高效整合的数字物流系统,促进人与人、人与物、物与物的全面互联和交融,激发每个人在任何时间、任何地点的无限机遇与潜能,推动世界进步。
华为中央硬件工程院介绍
        2012实验室中央硬件工程院承担了华为集团硬件工程的硬件架构及关键技术突破的重任,以工程样机为载体,开展硬件工程领域的关键技术创新、探索技术极限、集成验证前沿技术,确保公司产品与解决方案的硬件工程领域技术竞争力持续领先,支撑公司长期商业成功。
        开放/合作/创新,面向未来,以工程样机和专业实验室为载体,整合全球战略资源,提前准备核心硬件、工程和工艺技术,做强纵深、不可替代,突破全联接世界的硬件工程关键技术,突破无人区,引领行业生态和产业发展。
        中央硬件工程院在美国、加拿大、德国、意大利、瑞典、芬兰、日本、深圳、北京、上海、杭州、南京、西安、成都、武汉等地已设立或正在设立多个专业实验室。在音视频媒体技术,工艺、材料、热设计、高速高频、EMC等工程技术领域处于业界领先水平,支持华为成为ICT行业领导者。
(本招聘最终解释权为华为技术有限公司)
Join Huawei, let’s build new world together!
Welcome to Huawei Central Hardware Engineering Institute.
       Huawei global talent recruiting! Join us and let’s build the fully connected new world together, on the cutting edge of ICT!
       We value your global vision. We offer you world wide platform to leverage. We welcome STEM PhD and Postdoc scholars to join Huawei. Let’s explore how to connect everything, make a better world more productive to everyone.
Recruitment Sessions
1、Switzerland Zurich
Time:19:00-21:00, Nov 21, 2016
2、Switzerland Lausanne
Time:19:00-21:00, Nov 22, 2016
3、Italy Milan
Time:19:00-21:00, Nov 23, 2016
4、France Paris
Time:19:00-21:00, Nov 24, 2016
5、Belgium Leuven
Time:19:00-21:00, Nov 25, 2016
6、Netherlands Delft
Time:15:00-17:30, Nov 26, 2016
Note
        We sincerely invite you to join our recruitment sessions. Please send your Chinese and English CVs to shina.ma@huawei.com and specify the position you apply for in the mail. Mail title template: School+specialized+the intention post + the city to participate, we will give you the meeting invitation according to CV and your location.
        If you have any question regarding our recruitment sessions, send an email to shina.ma@huawei.com.
Talents needed
        The PhD graduated from 1st June, 2015 to 31st December, 2017.
Professional needs
        We are inviting applications from PhD and experienced Postdoctors in related fields including but not limited to mathematics,physics, chemistry, mechanics, phonics, thermo-physics, electronics and telecommunication, electromagnetism, Materials Technology ,optics, power electronic, material technology, software engineering, medium engineering, microelectronic, radio frequency and microwave, mechanical engineering,  computing and memory, component, sensor, accelerator, and so on.
Job description
1 Signal   Processing  Engineer 
Requirements:
1. Electronics, communication, signal processing and other related professional;
2.Understand the principle of communication, familiar with the PHY layer of the basic algorithm principle and process, has a deep understanding of the priority modulation demodulation and other physical layer algorithm. Familiar with MAC layer basic algorithm principle and process. Skilled use of algorithm simulation tool matlab.
2 Media Computation  Research Engineer
Requirements:
1. Majored in Computers, Automation, Applied Mathematics, Acoustic Processing, Signal and Information Processing, Pattern Recognition, Artificial Intelligence, Opto-electricity, etc;
2. Experienced in the visual intelligence, speech intelligence, depth study, video processing, audio frequency processing, imagery processing and terminal multimedia and other engineering research and system design and technology development.
3 Sensor Applied Research Engineer
Requirements:
1. Majored in Computer, Sensor, Electron, Automation, Mathematical and Electro-optic, Supersonic and Fresh Meter, Signal and Information Processing, Pattern Recognition and Artificial Intelligence etc;
2. Experienced in research and algorithms/component design development and system designing of the motion detection, the symptom examination, the biological recognition and intelligence alternately, scene sensation, etc .
4 Storage Medium/ Algorithm Research Engineer
Requirements:
1. Majored in Computer, Correspondence, Mathematical, Physics, Micro electron and Automation;
2. Familiar with signal processing, familiar the BCH, LDPC and other ECC algorithms, experienced in the SSD, Flash, the new medium, algorithm and controller development, the GPU development and distributional memory software, save the cluster management.
5 Data Center Network Research Engineer
Requirements:
1. Majored in Computer,  Correspondence, Mathematical and other networks were related;
2. Experienced in the network low time delay and fusion network protocol and isomerism resource pool, NFV/SDN and network architecture modelling and network traffic modelling, the network algorithm and network to transport the Uygur and other aspect.
6 Accelerator Computation  Research Engineer
Requirements:
1. Majored in Computer Architecture, , Communication Engineering, Electronic Engineering, Micro electron, Mathematics and Physics ;
2. Experienced in the isomerism acceleration modelling and machine learning, data compression, data mining, security and trusted computing and distributed computing (Hadoop/Spark), pattern matching.
7 Processor Computation Research Engineer
Requirements:
1. Majored in Computer system Paradigm, Machine Learning, Database, Data mining, Mathematics, Cryptology, Safety, Mathematics and other specialties;
2. Experienced in the processor construction research, simulation, design and others.
8 Hardware Security Algorithm Engineer
Requirements:
1.Majored in Information Security, Micro-electron, Physics and Mathematical;
2.Grasped the commonly used hardware security protection and evaluation method, experienced in the research of the breakdown to inject, the side channel safety protection algorithm design experience, the security threat analysis and crypto-algorithm to design.
9 Optical Design Technology Engineer
Requirements:
1. Majored in Optical engineering and Electro-optical Information Engineering, Physical Electronics, Microelectronics and Solid state Electronics, Electronic Information Material Semiconductor chip system design and craft, Material Physics and Chemistry, Electric Power Electron and Electric drive and Integrated Circuit Engineering, Electronic and Communication Engineering;
2. Experienced in the phantom system optical design, optics simulation and optical property test and lens manufacture set up the technology with the group near or far infrared image system.
10 Process Reliability Engineer
Requirements:
1. Majored in Electronic Seal, Machinery, Mechanics and Material;
2. Experienced in the Braze welding reliability, electronic seal reliability and reliability mathematics statistical analysis, finite element simulation and mechanics analysis (structural strength, strain test and stress appraisal), failure analysis (slice and microscopic observation)”.
11 Polymer Material Technology Engineer
Requirements:
1. Majored in the Macromolecule Modification and Macromolecule Synthesis, the Organic Synthesis, Chemistry and others;
2. Experienced in the topic and application/project is related, non-theoretical calculation, technique of the material attribute parsing.
12  (Semiconductor) Component Reliable Engineer
Requirements:
1.  Majored in Electronic Engineering, Micro Electron, Semiconducting Material and Electronic;
2.  Experienced in the common failure mode and mechanism of familiar semiconductor device, to the reliability model and experimental design, the data processing and so on.
13 Sensor Component Research Engineer
Requirements:
1.  Majored in Electronic Science, Sensor Technology, Micro Electron, Machinery, Micro Nano and Semiconductor;
2.  Familiar sensor design, craft and seal characteristic, intelligent terminal, terminal sensor’s trend of development, sensing class component common flaw pattern and mechanism.
14 Audio Frequency Component Engineer
Requirements:
1.  Majored in Acoustics, Electronic Science and Technology;
2.  Understanding acoustics principle knowledge, familiar audio frequency component trends of development and technical guideposts.
15 Electro-Optical Interconnection Project Engineer
Requirements:
1. Majored in the Electro-optical Information Engineering, the Fiber Optic Communications and Electromagnetic Field Microwave and others;
2. Familiar digital optical communication theoretical knowledge, has certainly to the mainstream light module and light component understood, familiar optical communication domain related profession standard and organization.
16 Radio Frequency Microwave Interconnection Engineer
Requirements:
1. Majored in Electromagnetic field and Microwave;
2. Experienced in the electromagnetic, microwave, radio frequency microwave channel and radio frequency/microwave link.
17 Electromagnetic Material Engineer
Requirements:
1. Majored in Electromagnetic field, Communications;
2. A good understanding of the metal and non-metallic material, the familiar structural material and craft related electromagnetic field, passive intermodulation and other aspect research work.
18 Functional Materials & Nonmetallic (Material) Engineer
Requirements:
1. Majored in Macromolecule or Non-metallic Inorganic Material;
2. A good understanding of organic or non-metallic inorganic material, know the light, sound, electricity, the magnetic related material and technology.
19 Thermal Design Engineer
Requirements:
1. Majored in Hot Physics, Thermal Engineering, Refrigeration and Low Temperature, Fluid Machinery and Acoustics Noise Reduction;
2. Experienced in heat transfer, refrigeration or the noise reduction and other project.
20 Electromagnetic Field and Microwave Engineer
Requirements:
1. Majored in Electromagnetic Field and Microwave;
2. Has the solid basic theory in the electromagnetic field and microwave technique, the antenna design and electromagnetism material and electromagnetism survey, has been engaged in the related project research.
21 Fluid dynamic engineer
Requirements:
1. Ph.D. in aerodynamics/fluid dynamics or Master degree in aerodynamics/fluid dynamics with 8+ years working experience in fan R&D. An experienced aerodynamic design expert with worldwide vision, with excellent understanding of air cooling fan application and low acoustic noise technology;
2. Experience in airfoil design for fan/blower/turbine machine is preferred. Successful practice in low acoustic noise technology study.Skill in CFD, CAA, Thermal and Acoustic noise simulation tools.
22 Motor Technology Research Engineer
Requirements:
1. Ph.D. in  mechanical and electrical integration, electrical machinery and electrical, automation, or other mechanical related major;
2. Familiarity with micro mechanical precision design, dynamic modeling and simulation, electromagnetic simulation design, magnetic materials, motor control and other advanced technologies.Skill in Pro/E, Solidworks, AutoCAD software for the design of three-dimensional and engineering drawings, proficient in Jmag, Ansoft software simulation applications.
23 Electrical Micro-machine Technology Research Engineer
Requirements:
1. Ph.D. in Micro-electromechanical Systems or related.
2. Grasp of VCM and MEMS design principles. Skill in micro mechanical precision design,electric simulation design, mechanical simulation design, Capability of MEMS chip performance test and experimental research.Skill in mechanical drawing and lithography template design tools including Solidworks/Pro-E/ACAD/ L-EDIT, and finite element analysis tools including Jmag/Ansoft.
24 Electrical Safety and Protection Research engineer
Requirements:
1.Majored in electric power and electronic engineering;
2.Have experience about electric power safety, protection and application, familiar with the basic principles of electric power safety, protection components (such as Fuse/ Breaker) , and can simulate, analyse and design the electric power safety, protection solution.
Work Locations
Shenzhen, Shanghai, Hangzhou, Xi’an, Chengdu, and so on.
Huawei Information
        Huawei is a global leader of ICT solutions. Continuously innovating based on customer needs, we are committed to enhancing customer experiences and creating maximum value for telecom carriers, enterprises, and consumers. Our telecom network equipment, IT products and solutions, and smart devices are used in 170 countries and regions. Huawei ranked 228th on the Global Fortune 500 based on its revenue in 2014.
        We invest over 10% of our annual sales revenue into R&D and more than 45% of our 170,000 employees engage in R&D. Leveraging our experience and expertise in the ICT sector, we help bridge the digital divide and promote high-quality broadband connectivity for all. As an advocate of socioeconomic sustainability, we make every effort to support secure and stable network operations, and help customers and industries improve efficiency to drive low-carbon economic growth. By localizing our operations and building a global value chain, we help local innovators maximize their global value and share win-win outcomes.
        A Better Connected World is on the horizon. Working closely with partners, we endeavor to build an efficient and integrated digital logistics system which will enhance interconnectivity and interactivity – between people and people, people and things, and things and things – to spark infinite opportunities and potential for everyone everywhere and to move the world forward.
The Central Hardware Engineering Institute
        The Central Hardware Engineering Intitute of 2012 Laboratory is responsible for the hardware architecture of Huawei hardware engineering and breakthroughs in key technologies. The Central Hardware Engineering Institute carries out technological innovations and integration development, creating prototypes. It tests and applies cutting-edge technologies to ensure continuous advanced technical competitiveness of Huawei products and solutions in the hardware engineering field that support Huawei business success.
        Opening / collaboration / innovation, future-oriented, professional laboratory and engineering prototype for the carrier, integration of global strategic resources, ready core hardware, engineering and technology advance, stronger depth and irreplaceable, join the world-wide breakthrough key technology hardware engineering , leading ecological and industrial development of the industry.        
        The Central Hardware Engineering Institute has established, or is establishing, professional laboratories in Italy, Germany, the United States, Sweden, Finland, and in China at Beijing, Shanghai, Chengdu, Wuhan, Nanjing, Hangzhou, Xi’an, and Shenzhen. Leading in Audio and video media technologies, processes, materials, thermal design, high-speed high-frequency, EMC engineering and other technical fields in the industry,support Huawei becoming a leader in the ICT sector.

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